Reliability of RoHS-Compliant 2D and 3D IC interconnects
by Lau, John H

(#0288SJ3)

Hardcover
McGraw-Hill, 2011

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Advanced Copper-Gold Wire-Stud Interconnection Technologies
by Lau, John, H

(#0408GVX)

Hardcover
McGraw-Hill Professional, 2012

Advanced MEMS packaging

(#0GJW787)

Hardcover
McGraw-Hill, 2010

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Through-Silicon Vias (Tsvs) for 3d Integration
by Lau, John, H

(#0408FV2)

Hardcover
McGraw-Hill Professional, 2012

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Microvias : for low-cost, high-density interconnects
by Lau, John H

(#0UY2803)

Hardcover
McGraw-Hill, 2001